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SM2
D-Sub connectors - Stamped and Formed Contacts
SURFACE MOUNT CONNECTORS
Specifications
? Connectors according to MIL C24308 - NFC 93425-HE5
Materials and Platings
Amphenol SMT D-Sub is offered in
right angle, receptacle with brackets,
as an industry standard for I / O
connections.
Shells
Insulator
Socket contact
Rear insert
Boardlock
Screwlock
Grounding
Steel with tin plating
High temperature (peak at 260°C) glass-filled
thermoplastic, UL 94V-0
Stamped and formed brass, selected gold in mating area;
2.54μm (100μ”) min. tin on termination area, with entire
contact under-plated 1.27μm (50μ”) min. nickel
Brass, 3μm up to 5μm (118μ” up to 197μ”) tinned over
nickel 2μm up to 3 μm (78μ” to 118μ”)
Tin plating 4μm up to 6μm (157μ” up to 236μ”) over nickel
2μm up to 3μm (78μ” up to 118μ”), insertion force:
Low Insertion Force = LIF (bronze)
Zero Insertion Force = ZeFo (bronze)
Brass, 6μm up to 10μm (236μ” up to 394μ”) tinned over
nickel 2μm up to 3μm (78μ” up to 118μ”)
Grounding strap: brass, 4μm up to 6μm tin plating over
nickel 2μm up to 3μm (78μ” up to 118μ”)
Electrical Data
Boardlock features:
-LIF (Low Insertion Force) boardlock
especially designed to be fully
compatible with pick and place
machine.
-ZeFo (Zero Force Insertion) boardlock
has been designed so that once placed
and expanded, secures a safe locking.
Designed for
Pick and Place
SMT process
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
3A
300V AC/rms 50Hz
1000V AC/rms 50Hz for one minute
5000M?
10m? max
? Industrial
Climatic Data
Operating temperature 85°C, peak at 105°C
? Telecom
? Any industry standard
Damp heat
56 days (40°C - 95% HR)
Mechanical Data
I / O connections
Single contact insertion force
Single contact withdrawal force
LIF boardlock
Coplanarity of contacts
Mating and unmating force
Unit: N
1.2N < F < 2.5N
0.4N min
8N max per connector
0.2mm (.008”) max
No. of Cts
9 (size E)
15 (size A)
25 (size B)
Mate (max)
30
50
83
Unmate (min)
3.5
4.5
8.0
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